Algorithm and simulation of heat conduction process for design of a thin multilayer technical device

Algorithm and simulation of heat conduction process for design of a thin multilayer technical device

Alexander Ayriyana, Jan Busa Jr.b,e, Eugeny E. Donetsc, Hovik Grigoriana,d, Jan Pribisa,e.

а) Laboratory of Information Technologies, JINR, Dubna, Russia
b) Institute of Physics, Academia Sinica, Nankang, Taipei, Taiwan
c) Veksler and Baldin Laboratory of High Energy Physics, JINR, Dubna, Russia
d) Department of Theoretical Physics, Yerevan State University, Yerevan, Armenia
e) Department of Mathematics and Theoretical Informatics, TU of Košice, Košice, Slovakia

A model of multi-layered cylindrical device with a non-trivial computational domain and nonlinear thermodynamic properties of materials at cryogenic temperatures is considered. This model describes so-called cryogenic cell designed for pulsing working gases into the multiply charged ion source chamber. The main requirement for operation mode of the cryogenic cell is the periodically opening and closing the valves for injecting gaseous substance in the millisecond range. A model implementation of the previously proposed idea of the temperature valves is realized, when the valve closing is ensured by freezing gaseous substance on the outer surface of the cell, and the opening of the valves is provided by heating of the surface of the cell to the desired temperature when the required vapor pressure achieved. The surface is heated by passing a pulsed electrical current through one of the conductive layer of the cell. The numerical algorithm for simulation of the thermal evolution with time-periodic source is developed, which was implemented in the OpenCL language for calculations on graphics processing unit. The algorithm makes possible the further optimization of the design of the cryogenic cell. The calculations were done on heterogenius cluster HybriLIT.

Alexander Ayriyan, Jan Busa Jr., Eugeny E. Donets, Hovik Grigorian, Jan Pribis. Algorithm and simulation of heat conduction process for design of a thin multilayer technical device // Applied Thermal Engineering (2016), vol. 94, pp. doi:10.1016/j.applthermaleng.2015.10.095